M/S LN Wrench

Features.

1.IRDA welder T-862  can desolder any components between 15 x 15 to 25 x 25mm.

2.Adopts  infrared weld technology which is developed independently.
Uses infrared heat lamp and ceramic preheating sol system . 

Heat is easy to pierce and distribute evenly, which overcomes the disadvantages (burn out components) of traditional welder machines.

3.Easy to operate, just need one day training, you can operate this machine.

4.Infrared heating no have sirocco flow, won't impact surrounding small components. It can be suitable for all of components such as BGA, SMD, CSP, LGA, QFP and PLCC.

Additional Information:

• Item Code: T862
• Delivery Time: 7-8 days
• Packaging Details: Power: 600W Voltage: AC110V-220V 50/60HZ Infrared lamp body power: 100W Preheating plate power: 350W Working bench size: 350*260mm Infrared lamp body heating size: 25*25mm Preheating plate size: 120*80mm Preheating plate temperature range: 60-200¿¿C Iron temperature range: 200-450¿¿ Infrared lamp body temperature range: 100-350¿¿C

Specifications:

• Total Power: 2300 W
• Top IR heater: 450W Bottom IR heater: 1800 W
• Power: AC 110V / 220V
• Positioning: V-groove, PCB support
• Temperature control: K Sensor, Closed loop
• Temp accuracy: ±2 degree
• PCB size: Max 270x320 mm Min 20x20 mm
• BGA chip size: 5*5~55*55 mm
• Minimum chip spacing: 0.15 mm
• Dimension: approx 480x370x390 mm
• Net weight: Approx 15.5KG
• Fully infrared, 2 zones

Additional Information:

• Item Code: DH-A01
• Production Capacity: 10
• Delivery Time: 7-10 Days

Specifications:

• Total Power: 2600 W
• Top IR heater: 800 W Bottom IR heater: 1800 W
• power: AC 110V / 220V
• Positioning: V-groove, PCB support
• Temperature control: K Sensor, Closed loop
• Temp accuracy: ±2 degree
• PCB size: Max 290x310 mm Min 20x20 mm
• BGA chip size: 5*5~55*55 mm
• Minimum chip spacing: 0.15 mm
• Dimension: approx 470x370x430 mm
• Net weight: Approx 15.5KG
• 2 zones, top hot air heating,
• Bottom IR heating.

Additional Information:

• Item Code: DH-6500
• Production Capacity: 10
• Delivery Time: 7-10 Days
• Packaging Details: BGA set : 1 and accessories

Specifications:

• Total Power: 4800 W
• Top hot air: 800 W Lower hot air: 1200 W
• Bottom IR: 2700 W
• Power: AC 110V / 220V
• Positioning: V-groove, PCB support
• Temperature control: K Sensor, Closed loop
• Temp accuracy: ±2 degree
• PCB size: Max 400x400 mm Min 20x20 mm
• BGA chip size: 2*2~80*80 mm
• Minimum chip spacing: 0.15 mm
• Dimension: approx 570x520x570 mm
• Net weight: Approx 30KG
• With digital vacuum sucker

Additional Information:

• Item Code: DH-08
• Production Capacity: 4400W
• Delivery Time: 7-10 Days
• Packaging Details: BGA Set and Accessories

Specifications:

• Total Power: 4350 W / 4800 W
• Top IR heater: 450 W Top hot air: 800 W Lower
• hot air: 1200W Bottom IR : 2700 W
• Power: AC 110V / 220V
• Positioning: V-groove, PCB support
• Temperature control: K Sensor, Closed loop
• Temp accuracy: ±2 degree
• PCB size: Max 390x370 mm Min 20x20 mm
• BGA chip size: 2*2~80*80 mm
• Minimum chip spacing: 0.15 mm
• Dimension: approx 560x490x580 mm
• Net weight: Approx 31KG
• Two top heads ( hot air / infrared )
• Soldering iron(80W) + Top air , Speed adjust function + Double , shadowless LEDS

Additional Information:

• Item Code: DH-390
• Production Capacity: 2500W
• Delivery Time: 7-10 Days
• Packaging Details: BGA Set 1pc and Accessories

Specifications:

• Total Power: 4800 W
• Top hot air: 800W Lower hot air: 1200 W
• Bottom IR: 2700W
• power: AC 110V / 220 V
• Positioning: V-groove, PCB support
• Temperature control: K Sensor, Closed loop
• Temp accuracy: ±2 degree
• PCB size: Max 400x400 mm Min 20x20 mm
• BGA chip size: 2*2~80*80 mm
• Minimum chip spacing: 0.15 mm
• Dimension: approx 560x590x690 mm
• Net weight: Approx 31KG
• 3 Zones, Digital Vacuum Pen,

Additional Information:

• Item Code: DH-C1
• Production Capacity: 10
• Delivery Time: 7-10 days
• Packaging Details: BGA Machine and accessories

Specifications:

• Product Overview :
• Total Power: 4400W
• Top hot air: 800W Lower hot air: 1200W
• Bottom IR: 2400W
• Power: AC 110V / 220V
• Positioning: V-groove, PCB support
• Temperature control: K Sensor, Closed loop
• Temp accuracy: ±2 degree
• PCB size: Max 370x370 mm Min 20x20 mm
• BGA chip size: 2*2~80*80 mm
• Minimum chip spacing: 0.15 mm
• Dimension: approx 540x480x540 mm
• Net weight: Approx 30KG
• Drawer-style touch screen, Digital vacuum Sucker, 3 zones

Additional Information:

• Item Code: DH-D1
• Delivery Time: 7-10 Days
• Packaging Details: Wooden Packing

Specifications:

• Product Overview :
• Total Power: 4500 W
• Top hot air: 800W Lower hot air: 1200 W
• Bottom IR: 2400 W
• Power: AC 110V / 220 V
• Positioning: V-groove, PCB support
• Temperature control: K Sensor, Closed loop
• Temp accuracy: ±2 degree
• PCB size: Max 405x370 mm Min 20x20 mm
• BGA chip size: 2*2~80*80 mm
• Minimum chip spacing: 0.15 mm
• Dimension: approx 570x610x570 mm
• Net weight: Approx 35 kg
• 3 Zones, Digital vacuum Sucker

Additional Information:

• Item Code: DH-5830
• Production Capacity: 4400W
• Delivery Time: 7-10 Days
• Packaging Details: 1. Machine:1 set 2. All packed in stable and strong wooden cases,suitable for import and export. 3. Top nozzle:3 pcs (31*31mm,38*38mm,41*41mm) Bottom nozzle:2pcs(34*34mm,55*55mm) 4. Beam:2 pcs 5. Plum knob: 6 pcs 6. Unicersal fixture:6 pcs 7. Support screw:5 pcs 8. Brush pen:1 pcs 9. Vacuum cup:3 pcs 10. Vacuum needle:1 pcs 11. Tweezer:1 pcs 12. Temp sensor wire:1 pcs 13. Professional Instruction Book:1 pcs 14. Teaching CD: 1 pcs

Specifications:

• Total Power: 4900 W
• Top hot air: 800 W Lower hot air: 1200 W
• Bottom IR: 2700 W
• power: AC 110 V / 220 V
• Positioning: V-groove, PCB support
• Temperature control: K Sensor, Closed loop
• Temp accuracy: ±2 degree
• PCB size: Max 440x390 mm Min 20x20 mm
• BGA chip size: 2*2~80*80 mm
• Minimum chip spacing: 0.15 mm
• Dimension: approx 610x620x560 mm
• Net weight: Approx 40KG
• Based on B1 model, adding more one camera and monitor, to see clearly the melting of
• Solder ball, for Analyzing and Correcting Temperature Conveniently

Additional Information:

• Item Code: DH-B1C
• Production Capacity: 10
• Delivery Time: 7-10 Days

LD-5860 - BGA Rework Station Non-optical & Touch Screen &Product Overview :

- Total Power: 4800W

- Top hot air: 800W Lower hot air: 1200W

- Bottom IR: 2700W

- power: AC 110V / 220V

- Positioning: V-groove, PCB support

- Temperature control: K Sensor, Closed loop

- Temp accuracy: ±2 degree

- PCB size: Max 420x400mm Min 20x20mm

- BGA chip size: 2*2~80*80mm

- Minimum chip spacing: 0.15mm

- Dimension: approx 635x635x560mm

- Net weight: Approx 40KG

- Top air speed adjusted function,

- Special good at repairing all kinds of bga chip sets from laptop, cell phone, desktop, computer, xbox360,sp3 ,receiver , game playe and so on.

Additional Information:

• Item Code: DH-5860
• Delivery Time: 7-10days

Product Overview :

- Total Power: 4900W

- Top hot air: 800W Lower hot air: 1200W

- Bottom IR: 2700W

- power: AC 110V / 220V

- Positioning: V-groove, PCB support

-Temperature control: K Sensor, Closed loop

-Temp accuracy: ±2 degree

- PCB size: Max 415x400mm Min 20x20mm

- BGA chip size: 2*2~80*80mm

- Minimum chip spacing: 0.15mm

- Dimension: approx 635x635x560mm

- Net weight: Approx 40KG

- Based on A1 model, adding more Laser+LED+Soldering iron (80W) 3 Zones,

- Digital vacuum Sucker, Thickest material.

Additional Information:

• Delivery Time: 7-10 Days

Specifications:

• Total Power: 5300W
• Top hot air: 1200W lower hot air: 1200W
• Bottom IR: 2700W
• power: AC110 / 220V
• Positioning: V-groove, PCB support
• Temperature control: K Sensor, Closed loop
• Temp accuracy: ±1 degree
• Workbench fine-tuning: ±15 mm forward/
• backward ±15 mm, right/left
• Placement accuracy: ±0.01 mm
• Camera magnification: 2x-220x
• PCB size: Max 390x400 mm Min 20x20 mm
• BGA chip size: 2*2~80*80 mm
• Minimum chip spacing: 0.15 mm
• Dimension: approx 610x570x750 mm
• Net weight: Approx 60 KG
• Optical CCD alignment system + Panasonic camera+ micrometers + HD monitor +Top air speed Ajusted function + Drawer-style touch screen

Additional Information:

• Item Code: DH-G200
• Delivery Time: 7-10 Days

Specifications:

• Total Power: 6500 W
• Top hot air: 1200W lower hot air: 1200 W
• Bottom IR: 3900 W
• power: AC110 / 220 V
• Positioning: V-groove, PCB support
• Temperature control: K Sensor, Closed loop
• Temp accuracy: ±1 degree
• Workbench fine-tuning: ±15 mm forward/backward ±15 mm
• right/left
• Placement accuracy: ±0.01 mm
• Camera magnification: 2x-220x
• PCB size: Max 420x470 mm Min 20x20 mm
• BGA chip size: 2*2~80*80 mm
• Minimum chip spacing: 0.15 mm
• Dimension: approx 730x670x940 mm
• Net weight: Approx 91KG
• Panasonic servo driver, plus size body.
• Optical CCD alignment system + Laser positioning
• + Panasonic camera + micrometers + HD monitor +
• Drawer-style touch screen + top air speed adjusted
• function
• Two modes: auto / manual
• Auto: automatic pick and place,
• heating and cooling
• Manual: manual up / down top
• head to pick and place bga by

Additional Information:

• Item Code: DH-A5
• Production Capacity: 10
• Delivery Time: 7-10 Days
• Packaging Details: BGA Machine and its Accessories

Specifications:

• Total Power: 6800 W
• Top hot air: 1200W lower hot air: 1200 W
• Bottom IR: 4200 W
• power: AC110 / 220 V
• Positioning: V-groove, PCB support
• Temperature control: K Sensor, Closed loop
• Temp accuracy: ±1 degree
• Workbench fine-tuning: ±15mm forward/ backward ±15mm right/left
• Placement accuracy: ±0.01mm
• Camera magnification: 2x-220x
• PCB size: Max 530x490mm Min 20x20mm
• BGA chip size: 2*2~80*80mm
• Minimum chip spacing: 0.15mm
• Dimension: approx 780x740x890mm
• Net weight: Approx 97KG
• Better Stepper motor driver than A2, plus size.
• Optical CCD alignment system + Laser positioning + Panasonic camera + micrometers + HD monitor
• Two modes: auto / manual
• Auto: automatic pick and place,heating and cooling
• Manual: manual up / down top head to pick and place bga

Additional Information:

• Item Code: DH-A4
• Production Capacity: 10
• Delivery Time: 10-15 Days

Specifications:

• Total Power: 4400W
• Top hot air: 800W Lower hot air: 1200W
• Bottom IR: 2400W
• power: AC 110V / 220V
• Positioning: V-groove, PCB support
• Temperature control: K Sensor, Closed loop
• Temp accuracy: ±2 degree
• PCB size: Max 500x400mm Min 20x20mm
• BGA chip size: 2*2~80*80mm
• Minimum chip spacing: 0.15mm
• Dimension: approx 635x635x560mm
• Net weight: Approx 40KG

Additional Information:

• Item Code: PMKVY
• Delivery Time: 7-10 Days
• Packaging Details: 1.Machine:1 set 2.All packed in stable and strong wooden cases,suitable for import and export. 3.Top nozzle:3 pcs (31*31mm,38*38mm,41*41mm) ¿¿ ¿¿Bottom nozzle:2pcs(34*34mm,55*55mm) 4.Beam:2 pcs 5.Plum knob: 6¿¿pcs 6.Universal fixture:6 pcs 7.Support screw:5 pcs 8.Brush pen:1 pcs 9.Vacuum cup:3 pcs 10.Vacuum needle:1 pcs 11.Tweezer:1 pcs 12.Temp sensor wire:1 pcs 13.Professional Instruction Book:1 pcs 14.Teaching CD for operation: 1 PCS Packing dimenssion:65*63*64mm ¿¿ ¿¿Net Weight:35KG ¿¿Gross Weight:45KG

Additional Information:

• Item Code: T862P
• Production Capacity: 800W
• Delivery Time: 7-10 Days
• Packaging Details: BGA Machine: 1 Set and accessories

 

Specification:

• Total Power: 5200W
• Top heater: 1200W
• lower heater: 1200W
• Bottom heater: 2700W
• power: AC220V/AC110 optional
• Positioning: V-groove, PCB support
• Temperature control: K Sensor, Closed loop
• Temp accuracy: ±1 degree
• workbench fine-tuning: ±15mm forward/backward ±15mm right/left
• Placement accuracy: ±0.01mm
• camera magnification: 10x-220x
• PCB size: Max 370x410mm Min 20x20mm
• BGA chip size: 2*2~80*80mm
• Minimum chip spacing: 0.15mm
• Dimension: approx 690x670x870mm
• Net weight: Approx 70KG

Additional Information:

• Item Code: DH-A2
• Production Capacity: 5200W
• Delivery Time: 7-10 Days

Technical Parameters

Additional Information:

• Item Code: T870A
• Delivery Time: 7-10 Days
• Packaging Details: Welding table main body : 1 Infra-red lamp body :1 Temperature sensor: 1 Board support of the circuit : 1 Power line : 1 user's manual(Compact disc) : 1

Technical Parameter:
Power : 1500W
Voltage and Frequency : AC 220V / 50Hz
Infrared lamp body power : 300W
Preheating chassis power : 1200W
Working bench size : 320 x 330 mm
Infrared lamp body heating size : 60 x 60 mm
Preheating Chassis preheating size :245 x 260 mm
Preheating Chassis temperature range : 0^oC - 350^oC
Net weight : 15 Kg

Additional Information:

• Item Code: T890
• Production Capacity: 1500W
• Delivery Time: 7-10 Days
• Packaging Details: BGA Machine, Power cable, Manual

Additional Information:

• Item Code: DH-A1LC
• Delivery Time: 7-10 Days

Product parameter

• Total Power 2500W
• Top heater 1200W Bottom heater 1200W Power AC110~240V±10¿¿¿ 50/60Hz
• Operation mode Two modes: manual and automatic.
• HD touch screen, intelligent man-machine, digital system setting. Optical CCD camera lens 90°open/folding Optical CCD 6 million pixel Monitor screen 1080P Camera magnification 1x - 220x Workbench fine-tuning: ±15mm forward/backward, ±15mm right/left, Upper micrometer for angle adjusting 60 Placement accuracy: ±0.01mm PCB position Intelligent positioning, PCB can be adjusted in X, Y direction with “5 points support” + V-groov pcb bracket + universal fixtures.
• Lighting Taiwan led working light, any angle adjustable Temperature profile storage 50000 groups Temperature control K sensor, close loop, PLC control Temp accuracy ±1¿¿¿ PCB size All kinds of mobile phone motherboard
• BGA chip 1x1 - 80x80 mm Minimum chip spacing 0.15mm
• External temper sensor 1pc Dimensions L420×W450×H680 mm
• Net weight 35KG

Additional Information:

• Item Code: DH-G730
• Delivery Time: 7-10 days
• Packaging Details: Wooden Packing

Specifications and technical parameterspower: AC 220V±10 50/60 HzTotal Power: Max 5300W Heater power: Top heater 1200 W Bottom heater 1200 W IR heater 2700 W Electrical materials intelligence Programmable controller, support connect computer Temperature control: K-type thermocouple (Closed Loop), independence temperature control,accuracy within±3
 Positioning: V-groove, PCB support PCB size: Max 410×370 mm Min 15×20 mm BGA chip: Max 80×80mm Min 2×2 mm Dimensions L640×W630×H920 mm Sensors 1 pc Weight 70kg Color gray

Additional Information:

• Production Capacity: 2
• Delivery Time: 10 DAYS
• Packaging Details: WOODEN BOX