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Optical Alignment & Fully-Auto – BGA Rework Station LD-A5

Specification Details
Product Name Optical Alignment & Fully-Auto BGA Rework Station
Model DH-A5
Brand Dinghua
Automatic Grade Automatic
Total Power 6500W
Top Hot-Air Heater 1200W
Lower Hot-Air Heater 1200W
Bottom IR Heater 3900W
Power Supply AC 110V / 220V
Positioning V-Groove, PCB Support
Temperature Control K Sensor, Closed Loop
Temperature Accuracy ±1°C
Workbench Fine-Tuning ±15 mm forward/backward and ±15 mm right/left
Placement Accuracy ±0.01 mm
Camera Magnification 2×–220×
PCB Size Minimum 20 × 20 mm; Maximum 420 × 470 mm
BGA Chip Size 2 × 2 mm to 80 × 80 mm
Minimum Chip Spacing 0.15 mm
Dimensions Approx. 730 × 670 × 940 mm
Net Weight Approx. 91 kg
Alignment System Optical CCD with laser positioning
Control Modes Automatic and Manual
Minimum Order Quantity 1 Unit

The Optical Alignment & Fully-Auto BGA Rework Station LD-A5 is designed for precise BGA chip removal, placement and rework on electronic circuit boards. Manufactured by Dinghua, this automatic machine features optical CCD alignment, infrared heating and closed-loop temperature control for accurate and efficient PCB repair.

Key Features:
  • Fully automatic BGA rework operation
  • Optical CCD alignment system with laser positioning
  • Panasonic camera and micrometers for precise alignment
  • Top and bottom heating system
  • Closed-loop temperature control with K-type sensor
  • Temperature accuracy of ±1°C
  • Workbench fine-tuning in forward/backward and left/right directions
  • Automatic pick-and-place, heating and cooling functions
  • Manual and automatic operating modes
  • Touchscreen control and adjustable top-air speed
Applications:
  • Laptop and desktop motherboard repair
  • Mobile phone PCB repair
  • BGA chip removal and replacement
  • PCB assembly and rework
  • Semiconductor and electronic component repair
  • Electronics manufacturing and service centers

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