BGA Rework Station DH-G730 is designed for precise reworking and chip-level repair of mobile phone motherboards, laptop boards, TFT/LCD monitors, printers, and other electronic circuit boards. It features optical CCD alignment, intelligent positioning, temperature control, and manual/automatic operation modes for accurate BGA component replacement.
Key Features:
- Manual and automatic operation modes
- HD touch screen with digital system control
- Optical CCD camera with 6 million pixels
- Camera magnification: 1X–220X
- 1080P monitor screen
- Placement accuracy: ±0.01 mm
- Intelligent PCB positioning with X/Y adjustment
- Five-point support + V-groove PCB bracket + universal fixtures
- Upper micrometer for angle adjustment
- Adjustable LED working light
- Temperature profile storage up to 50,000 groups
- K-sensor temperature control with closed-loop PLC control
- External temperature sensor included
Specifications:
- Model: DH-G730
- Brand: Dinghua
- Total Power: 2500W
- Top Heater: 1200W
- Bottom Heater: 1200W
- Power Supply: AC 110–240V ±10%, 50/60Hz
- Workbench Fine-Tuning: ±15 mm forward/backward, ±15 mm right/left
- Optical CCD: 90° open/folding
- Temperature Control: K Sensor, Closed Loop, PLC Control
- PCB Size: Suitable for mobile phone motherboards
- BGA Chip Size: 1 × 1 to 80 × 80 mm
- Minimum Chip Spacing: 0.15 mm
- External Temperature Sensor: 1 pc
- Dimensions: L420 × W450 × H680 mm
- Net Weight: 35 kg
- Warranty: 1 year
Applications:
- Mobile Phone Motherboard Repair
- Laptop & Computer Repair
- TFT/LCD Monitor Repair
- Printer PCB Repair
- BGA Chip Replacement
- Chip-Level Electronics Repair
- Small Control Board Repair
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