The LD-870A BGA Rework Station is designed for repairing and reworking BGA components on mobile phones, laptops, desktop PCBs and other electronic circuit boards. It uses infrared heating technology with a focused heating lamp and a preheating platform to support controlled component removal and replacement.
Key Features:
- Infrared heating technology for BGA rework
- Adjustable infrared lamp temperature
- Integrated preheating platform
- Separate temperature controls for the infrared lamp and preheater
- Focused heating for precise component repair
- Designed to reduce the impact of hot-air flow on nearby components
- Suitable for laptop, mobile and desktop PCB repair
- Manual and semi-automatic operation
Applications:
- BGA chip removal and replacement
- Laptop motherboard repair
- Mobile phone PCB repair
- Desktop computer motherboard servicing
- Electronic component rework
- Electronics repair workshops and service centers
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