The LD-862 BGA Rework Station is designed for desoldering and reworking electronic components on mobile phones, tablets, and other PCB assemblies. It uses infrared heating technology with a ceramic preheating system to provide controlled heat distribution for component removal and replacement. Its focused heating design helps minimize the impact of heat on surrounding components.
Key Features:
- Infrared heating technology with a ceramic preheating system
- Designed for desoldering components between 15 × 15 mm and 25 × 25 mm
- Separate heating systems for focused infrared heating and PCB preheating
- Adjustable temperature settings for different rework requirements
- No forced hot-air flow, helping reduce disturbance to nearby components
- Suitable for BGA, SMD, CSP, LGA, QFP, and PLCC components
- Manual and semi-automatic operation
- Suitable for mobile phone and tablet repair
Applications:
- BGA chip removal and replacement
- Mobile phone motherboard repair
- Tablet PCB repair
- SMD and Micro BGA component rework
- Electronics repair and servicing workshops
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