The Non-Optical & Touch Screen LD-A1L BGA Rework Station is designed for professional PCB repair and BGA component rework. It features a digital touch-screen interface, infrared heating technology, and a three-zone heating system for controlled heating during component removal and replacement. The machine also includes a digital vacuum sucker and supports a wide range of BGA chip sizes.
Key Features:
- Touch-screen control for convenient operation
- Three-zone heating system with top hot air, top infrared, and bottom infrared heating
- Total system power of 4900W
- K-sensor closed-loop temperature control
- Temperature accuracy of ±2°C
- V-groove positioning system with PCB support
- Supports BGA chip sizes from 2 × 2 mm to 80 × 80 mm
- Minimum chip spacing of 0.15 mm
- Includes an additional laser, LED, and 80W soldering iron system
- Digital vacuum sucker for component handling
Applications:
- BGA chip removal and replacement
- Laptop and desktop motherboard repair
- Mobile phone PCB repair
- Large and small PCB component rework
- Electronic component soldering and desoldering
- Professional electronics repair centres and service workshops
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